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Development methodologies: most of them Web based.
As to the actual technology of the implementations, we'll use whatever is available from the various foundries, at the best price/performance ratio. We expect that by 2000, 5-layer 0.25 micron will be a tried and proven technology available from various foundries at "commodity" prices ($ 3.000 per 8-inch wafer). Around 2002, 5-layer 0.18 micron should be similarly available and it will be time to produce an F2 implementation (with up to four internal FPUs). Etc...
The F-Project was not created to develop new IC manufacturing technologies, which are usually protected by a number of patents and secrets. Those technologies are available from foundries all over the world, and there is even excess manufacturing capacity.
Our mission is to develop a new CPU architecture, and always have an up-to-date implementation available for manufacturing using current IC technologies.
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